Huawei recently announced its upcoming P70 series smartphones, which will be powered by a new HiSilicon processor called the “Kirin 9010.” While the chip has not been officially unveiled yet, development has been underway for some time. According to leaked […]
Huawei recently announced its upcoming P70 series smartphones, which will be powered by a new HiSilicon processor called the “Kirin 9010.” While the chip has not been officially unveiled yet, development has been underway for some time. According to leaked information on the Chinese social media platform Weibo, insider Smart Pikachu shared this exciting news.
The Kirin 9010 chip was first mentioned three years ago and it is planned to be produced using a cutting-edge 3nm process. The chip’s architecture is said to be provided by TSMC, the leading Taiwanese semiconductor company. However, it is also possible that Huawei is using the well-known Kirin name as a marketing strategy, considering that the company has already registered and protected this name in 2021.
Expectations for the Huawei P70 series include the return of 5G support to Huawei devices. According to rumors, the flagship model, P70 Pro Art, will feature an ultra-wide camera with a 1-inch sensor and a high-quality lens with a 1G6P configuration (one glass and six plastic elements). Additionally, Huawei is developing its own camera sensors, which will also debut in the P70 series phones.
There have been speculations about the possibility of Chinese semiconductor manufacturer SMIC working on a 3nm chip as well. However, there is currently no confirmation on this project.
- What is the name of the new Huawei processor?
The new Huawei processor is named “Kirin 9010”.
- When will the Huawei P70 series be launched?
According to some announcements, the Huawei P70 series smartphones could be unveiled in March.
- What performance can be expected from the Kirin 9010 chip?
The Kirin 9010 chip is planned to be produced using a 3nm process, but detailed performance information is not yet available.