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A New Era of High Bandwidth Memory: HBM4 to be Developed by SK Hynix in 2024

Summary

In a groundbreaking announcement, SK Hynix, a leading memory chip manufacturer, has revealed its plans to commence the development of high-performance HBM4 memory in 2024. This news comes on the heels of similar announcements by Micron and Samsung regarding their […]

SK Hynix najavljuje razvoj HBM4 memorije za 2024. godinu

In a groundbreaking announcement, SK Hynix, a leading memory chip manufacturer, has revealed its plans to commence the development of high-performance HBM4 memory in 2024. This news comes on the heels of similar announcements by Micron and Samsung regarding their own next-generation HBM4 chips, underscoring the significant importance that the industry places on advancing these types of memory solutions.

Alongside the development of HBM4, SK Hynix also intends to initiate the production of an enhanced variant of HBM3 memory, aptly named HBM3e, in the same year. Boasting higher speeds and capacities, the company aims to solidify its market dominance and expects to achieve this goal with mass production of HBM3e chips next year.

The progress made in developing HBM4 memory represents a significant leap forward in continuous memory solution advancements for future generations. However, due to the expected timeline, products utilizing HBM4 memory may not be anticipated until late 2025 or early 2026.

The advantages of HBM4 memory lie in its increased capacities and data transfer speeds. Initial HBM4 chip samples are expected to offer capacities of up to 36 GB per chip, with comprehensive specifications set to be released in the second half of 2024 by the JEDEC organization.

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